Diamond wire multi-wire slicing is utilized to control warp, bow, and TTV; double-sided grinding is applied to eliminate the chopping damage layer and raise warp, bow, TTV and LTV; double-sided polishing is utilized to lessen the roughness less than 2nm. 耐高温、高效率和轻量化等特点极大地丰富了碳化硅的应用场景，�